Solvent Bonding

• Good Aesthetics
• Economic Assembly
• Good for heat sensitive materials
• Good Sealing and insulation

• Possible entrapment of solvent in the joint
• Can only be used when both materials are soluble to the same solvent
• High Solvent Evaporation Time
• Disassembly is not possible
• Stress cracking/crazing

Ultrasonic Welding

• Low Cycle Times
  
• Low Capital Costs
  
• Flexibility
  
• Cleanliness
  
• Bonding of dissimilar materials

• Limited by the thickness of the materials
  
• May Require specialized tooling
  
• Noise Damage can be caused to the components or cold solder joints on some electronics (PCB’s)

Heat Staking

• Low Cost
  
• Repeatability
  
• Strength of bond
  
• Aesthetics
  
• Ease of disassembly

• Rebound can occur in some thermoplastics

Over Molding

• Water resistant seal
  
• Sound Absorption
  
• Strength of Bond

• Adhesion is limited to material choices
  
• Expensive Tooling
  
• Can not be disassembled